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Also also also if you have a two-sided board, you can load the difficult parts on one side, then take a reasonably thick piece of aluminum plate and cut out holes where those parts live, and put the board face-down on the plate on the hotplate and load qfn’s on the topside as well. Also also, you can often check continuity on individual leads by checking for the reverse body diode drop from a lead to ground. Also, Metcal sells one tip with an end radius of like 0.16mm, fine enough to touch the exposed metal on the sides of some QFN’s so you can reflow to the pad. It works better if you use lead-based solder: enough capillary action to self-center the part. I put a dot of solder on the center of the DAP and put the chip on that, so I know that the DAP solder has reflowed when the chip drops down onto the outer pads. I use a lab hotplate (with circuit boards bolted onto the sides to act as hand-rests so you don’t burn your hands on the top.) It works well at 200C.

I do this pretty regularly at work, since we make qfn’s.